A mask aligner is an instrument enabling photolithography (also called optical lithography),
which is a microfabrication process used to selectively remove parts of a thin film to create a
pattern or a design onto a substrate. To generate this pattern, the substrate is first coated with a
light-sensitive chemical (photoresist, or simply “resist”). (Coating of the substrate with a resist
can be performed with the Spin Coater) The substrate is then introduced into the mask aligner
and a mask with the desired pattern is placed above the substrate. A high intensity ultraviolet
light is shined over the mask. The light only transmits through the openings in the pattern
allowing to pattern corresponding areas of the photoresist layer of the substrate. Mask aligners
are widely used to generate integrated electronic circuits, specialty photonics materials and
microfluidic channels.

Feature and benefit

• Stand-alone, double sided, motorize alignment and tunable exposure system.
• Uses a photomask holder for glass and quartz
• Uses a substrate holder with stepper motors for X, Y, Z and Theta alignment
• Provides rapid and precise alignment of substrates with respect to photomasks
• Designed to accommodate wafers of 4″ in diameter
• Uniformity: <+ 6%
• Exposure intensity peaks at 365nm
• Available with dual cameras
• Vacuum Chuck
• Precision Alignment Module
• Interchangeable Mask Holders and Substrate Chucks
• Accurate alignments to 1 micron
• Anti-vibration and passive benchtop isolation system